DC magnetron sputtering equipment (2)

Computational conditions

  • Cylindrical coordinate
  • DC 200[V]
  • Gas Ar, 5[mTorr]
  • Magnetic flux density on the target 0.012[T]
  • Target - substrate distance 3.0[cm]

Result

  • Electron density

    Electron density

  • Ar+ density

    Ar+ density

  • Ionization rate

    Ionization rate

  • Ar+ flux

    Ar+ flux

  • Electric potential

    Electric potential

  • Space charge density

    Space charge density