# Partile In Cell with Monte Carlo Collision Module

PIC-MCCM computes spatial distribution of density, energy of charged particles and electric field etc., in a reactor by particle model.

## Description

PIC-MCCM is a module to compute plasma parameters of non-equilibrium and low temperature plasma in various semiconductor manufacturing reactors, magnetron sputtering reactors and thin-film manufacturing reactors. A numerical method of behavior of charged particles is PIC(Particle-In-Cell) method and a numerical method of collision between charged particles and neutral particles (elastic, inelastic such as ionization, excitation, charge exchange and dissociation etc.) is Monte Carlo method, respectively. PIC-MCCM is a module to compute the motion of charged particles by small time steps(<=ns) in the electric field generated by spatial charge and electrodes(RF,DC and grounded),insulators and/or ICP coils under magneto-statistical field in two-dimensional Cartesian or cylindrical (axial symmetry model) coordinates.## Input data

- Specify computational domain, RF and DC electrodes, insulators and/or ICP coils defined by two-dimensional rectangular mesh system in Cartesian or cylindrical (axial symmetry model) coordinates.
- Specify species of fed or background gas
- Select the reaction (elastic, ionization, excitation, dissociation and recombination etc.)between particles defined by internal database through PEGASUS/GUIM
- Specify file name containing magnetic flux density

## Output data

- Spatial distributions of density, energy and flow velocity for each charged particles.
- Spatial distributions of source rates of charged particles, radical and excited neutral particles.
- Particle and energy fluxes of each charged particles on the targets and walls.
- Spatial distributions of electric potential and electric field.
- Energy distribution function of charged particles.

## Example

- Ion beam path calculation
- Unbalanced magnetron sputtering system
- Planar magnetron sputtering sysmte
- Coaxial cylinder magnetron
- Analysis of a Magnetron Sputtering Equipment
- DC magnetron sputtering equipment (1)
- DC magnetron sputtering equipment (2)
- Self-ionized sputtering
- Plasma parameter analysis in a RF magnetron sputtering equipment
- Plasma calculation in a GEC Reference Cell type device
- PIC-MCCM and DSMCM coupling calculation